{"id":3463,"date":"2021-06-25T11:32:52","date_gmt":"2021-06-25T09:32:52","guid":{"rendered":"https:\/\/www.chemsolutions.it\/product\/ecorel-free-305-21-2\/"},"modified":"2024-07-22T16:58:24","modified_gmt":"2024-07-22T14:58:24","slug":"ecorel-free-305-21-2","status":"publish","type":"product","link":"https:\/\/www.chemsolutions.it\/en\/product\/ecorel-free-305-21-2\/","title":{"rendered":"ECOREL\u2122 FREE 305-21"},"content":{"rendered":"<p>ECOREL\u2122 FREE 305-21 is a solder paste specially designed for applications requiring high chemical reliability or where <a href=\"https:\/\/www.chemsolutions.it\/en\/approfondimento\/residue-after-reflow\/\" target=\"_blank\" rel=\"noopener\">residue clean-up after remelting<\/a> is required.<\/p>\n<p>This product from <a href=\"https:\/\/www.inventec.dehon.com\/\" target=\"_blank\" rel=\"noopener\">Inventec<\/a> has excellent values in the <a href=\"https:\/\/www.chemsolutions.it\/en\/approfondimento\/bono-corrosion-test\/\" target=\"_blank\" rel=\"noopener\">Bono corrosion test<\/a>, a method that allows better quantification and differentiation of the risk related to corrosion mechanisms and leakage currents in No Clean processes.<\/p>\n<p>On request, ECOREL\u2122 FREE 305-21 is also available with other alloys and different grain sizes.<\/p>\n<p>&nbsp;<\/p>\n<p><strong><em>Features:<\/em><\/strong><\/p>\n<ul>\n<li>Excellent wetting properties on all surface finishes, including OSP<\/li>\n<li>No graping, even on very small deposits<\/li>\n<li>Transparent and colourless residue, even after several remelting cycles<\/li>\n<li>Minimises downtime<\/li>\n<li>Good yield testability on first pass in ICT<\/li>\n<li>Lead-free<\/li>\n<li>Halogen free<\/li>\n<li>Free of CMR-containing substances.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><em><strong>Application:<\/strong><\/em><\/p>\n<p>The best process depends on factors such as operating conditions, equipment, board or component design.<\/p>\n<p>&nbsp;<\/p>\n<p>SOLDER PASTE PREPARATION<\/p>\n<p>Keep the paste at room temperature for at least 4 hours before use.<\/p>\n<p>Before printing, it is essential to mix the solder paste correctly, either manually with a spatula or by making several preliminary prints on the stencil.<\/p>\n<p>Automatic mixing of the solder paste is neither necessary nor recommended.<\/p>\n<p>&nbsp;<\/p>\n<p>PRINTING GUIDELINES<\/p>\n<p>Apply the solder paste to the stencil in such a way that it forms a 1 to 2 cm diameter roll along the entire spatula, or approximately 100 g per 10 cm length of the spatula.<\/p>\n<p>In this way, the solder paste will roll easily under the squeegees to provide excellent print quality.<\/p>\n<p>&nbsp;<\/p>\n<p>REFLOW GUIDELINE<\/p>\n<p>Although this paste performs very well in air, a nitrogen atmosphere will further improve wettability, allowing for an even wider reflow process window.<\/p>\n<p>A linear preheat ramp is recommended, however high density boards may require a soak zone during preheating to stabilise the temperature on the circuit before the reflow peak.<\/p>\n<p>&nbsp;<\/p>\n<p><em><strong>Packaging:<\/strong><\/em><\/p>\n<ul>\n<li>250 g or 500 g tin<\/li>\n<li>600 g or 1200 g cartridges<\/li>\n<li>30 g and 100 g syringes<\/li>\n<\/ul>\n","protected":false},"author":1,"featured_media":3399,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"class_list":["post-3463","product","type-product","status-publish","has-post-thumbnail","hentry","product_category-electronics","product_category-solder-pastes-en","product_partner-inventec-en"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v23.2 - 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