{"id":4365,"date":"2026-09-18T16:48:07","date_gmt":"2026-09-18T14:48:07","guid":{"rendered":"https:\/\/www.chemsolutions.it\/product\/thermasolv-cf5\/"},"modified":"2026-09-18T18:23:07","modified_gmt":"2026-09-18T16:23:07","slug":"thermasolv-cf5","status":"publish","type":"product","link":"https:\/\/www.chemsolutions.it\/en\/product\/thermasolv-cf5\/","title":{"rendered":"THERMASOLV\u2122 CF5"},"content":{"rendered":"

THERMASOLV CF5: Dielectric Fluid for Single-Phase Immersion Cooling<\/p>\n

What is THERMASOLV CF5?<\/h3>\n

THERMASOLV CF5<\/strong> is a dielectric heat transfer fluid developed by Inventec<\/a> for single-phase immersion cooling<\/strong> in electronic and industrial applications.<\/p>\n

It provides an alternative to 3M Fluorinert FC-770<\/strong>, subject to verification of material compatibility and system operating requirements.<\/p>\n

Its combination of electrical insulation, low viscosity and heat transfer properties makes it suitable for cooling sensitive electronic components. With a GWP of 2.5<\/strong> and zero ozone depletion potential<\/strong>, THERMASOLV CF5 is an option for applications seeking a low-GWP dielectric coolant.<\/p>\n

Electrical Insulation and Cooling Performance<\/h3>\n

THERMASOLV CF5 provides the electrical insulation needed for direct contact with electronic components in appropriately designed immersion cooling systems.<\/p>\n

Its low kinematic viscosity of 0.71 cSt<\/strong> facilitates fluid circulation and helps limit pressure losses and pumping requirements. Its wetting and thermal properties support contact with component surfaces and heat transfer to the cooling circuit.<\/p>\n

In single-phase immersion cooling, the fluid remains liquid during operation, absorbing heat from immersed components and transferring it to a heat exchanger.<\/p>\n

Key Technical Properties<\/h3>\n\n\n\n\n\n\n\n\n\n\n\n\n
Property<\/th>\nValue<\/th>\n<\/tr>\n
Ozone depletion potential (ODP)<\/td>\n0<\/td>\n<\/tr>\n
Global warming potential (GWP, F-gas III)<\/td>\n2.5<\/td>\n<\/tr>\n
Boiling point<\/td>\n110 \u00b0C \/ 230 \u00b0F<\/td>\n<\/tr>\n
Pour point<\/td>\n\u221290 \u00b0C \/ \u2212130 \u00b0F<\/td>\n<\/tr>\n
Kinematic viscosity<\/td>\n0.71 cSt<\/td>\n<\/tr>\n
Liquid density<\/td>\n1,580 kg\/m\u00b3<\/td>\n<\/tr>\n
Thermal conductivity<\/td>\n0.077 W\/(m\u00b7K)<\/td>\n<\/tr>\n
Dielectric breakdown voltage<\/td>\n18 kV<\/td>\n<\/tr>\n
Water content<\/td>\n< 1 ppm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Refer to the product technical data sheet for measurement conditions and test methods. Operating limits should be assessed for the specific cooling system.<\/p>\n

Benefits of THERMASOLV CF5<\/h3>\n

THERMASOLV CF5 combines properties relevant to electronic and industrial thermal management:<\/p>\n