ECOREL™ FREE 305-WS12 is a water-soluble flux solder paste, manufactured by Inventec, specifically designed for SMT and fine-pitch semiconductor processes where flux removal after reflow is required.

The formulation of ECOREL™ FREE 305-WS12 solder paste has been optimized to achieve excellent wettability.

Long life on the stencil and excellent bonding power ensure stability during use.

Features:

• High productivity
• Excellent wettability on all surface finishes, including OSP
• Excellent paste transfer volume
• Good testability
• Easily cleanable post-weld residue
• Lead-free
• Free of CMR-containing substances
• Greenway product.

Application:

The best process depends on factors such as operating conditions, equipment, board or component design.

Solder paste preparation:

• Place the paste at room temperature for at least 4 hours before use.
• Before use, it is essential to mix the solder paste properly, either manually with a spatula or by making several preliminary prints on the stencil.
• Automatic mixing of solder paste is neither necessary nor recommended.

Printing guideline:

Apply the solder paste to the stencil to form a 1 to 2 cm diameter roll along the squeegee or about 100 g per 10 cm length of the squeegee.

In this way, the solder paste will roll easily under the squeegee to provide excellent print quality.

Packaging:

• 250 - 500 g tin
• cartridge 600 g