Cleaning of solder paste residues


TOPKLEAN™ EL 20A has been specially developed by Inventec for the cleaning of solder paste residues and all types of solder fluxes as well as misprinted solder pastes on PCBs.

The use of TOPKLEAN™ EL 20A as a co-solvent together with PROMOSOLV™ DR1 or the new PFAS-free solvent PROMOSOLV™ NEO A1 greatly increases its cleaning and drying performance.

It is a new generation cleaner especially formulated to remove all types of baked-on flux residues and contaminants (fingerprints, dust, etc) left on printed circuit board assemblies or semiconductor modules. Its high wetting performance permits to efficiently remove new lead free soldering pastes and fluxes found in the market and to clean miniaturized designs in difficult access areas.



  • It is not regarded as a flammable product, but as a burnable one. All relevant measures against fire and risks must be fulfilled
  • Avoid contact with eyes and skin
  • It has a low environmental impact, emissions are very low at operating temperatures. It does not harm the ozone layer and is easily biodegradable
  • It can be recycled by vacuum distillation without affecting composition and properties.



Inventec has designed a non-flammable solvent based process in vapour phase equipment for defluxing of solder paste residues after die attach, flip chip or SMT reflow process.



  • 20 l drum
  • 200 l drum
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