ECOREL™ EASY 802S is a No Clean SnPb solder paste developed by Inventec.

Its rheological properties are suitable for the pin-in-paste process.

Lead-containing alloys are perfectly suited to withstand high and constant temperature variations (-40 to >130 °C).

However, the use of lead solder is limited due to the environmental impact of lead.

Exceptions are automotive, aerospace and defence electronics.

Features:

• Excellent print accuracy and excellent paste deposition results
• Excellent wettability on all surface finishes, including OSP
• Withstands high thermal profiles
• Flux residues can be left on the assembly as they are non-corrosive
• No CMR-containing substances in fluxing media
• Long stencil life, > 8 hours
• Printing speed: 60-150 mm/sec.
• High RH solderballing resistance
• No slump from preheating
• Halogen free.

Application:

The best process depends on factors such as operating conditions, equipment, board or component design.

Preparing the solder paste

Before printing, it is essential to mix the solder paste correctly, either manually with a spatula or by making several preliminary prints on the stencil.

Printing

ECOREL™ EASY 802S solder paste is particularly easy to print on stencils up to 0.3 mm pitch and up to 150 mm/sec. squeegee speed.

Packaging:

• 250 g or 500 g tin
• 700 g or 1400 g cartridge
• 800 g syringe