ECOFREC™ 200 is a low-residue, alcohol-based, no-clean flux produced by Inventec and recommended for soldering in a controlled atmosphere with air or nitrogen.

Good solder joints without solderballing are obtained with this low-residue flux.

Features:

• Compatible with a wide range of solder masks
• Compatible with various lead-free PCB finishes such as Ni/Au, Sn, Ag, HAL and OSP
• No microballing
• Can be used with leaded and lead-free products
• Passes Bono corrosion test
• No CMR substances
• Halogen-free.

Application:

The best process depends on factors such as operating conditions, equipment, board or component design.

ECOFREC™ 200 should be handled in a well-ventilated room away from any flame. Fumes should be evacuated from workstations by efficient exhaust.

ECOFREC™ 200 can only be applied by spraying, by spraying under air or nitrogen pressure, or by ultrasound.

The use of nitrogen allows greater flexibility of use when the application requires increasing the preheating temperature to reduce thermal shock and thus to ensure better removal of flux residues. In particular, the nitrogen atmosphere allows for better soldering of components, regardless of their level of oxidation.

Packaging:

• 20 l plastic drum
• 10 cc flux pen