ECOFREC™ TF48 is a tacky flux paste designed by Inventec for soldering and rework of traditional components and SMDs; it is particularly efficient for lead and lead-free components balling using spheres interconnection and for BGA repair.
ECOFREC™ TF48 is a high viscosity tacky flux made of a complex blending of resins, activators and solvents. After soldering, flux residues remaining on the PCB are chemically inert and not liable to corrosion. PCB cleaning is thus unnecessary.
Features:
- High viscosity tacky flux to keep components firm in place
- Non corrosive residues
- Stable process as great reproducible volumes of flux are applied
- No flux residues cleaning required
- No CMR substances
- Free of halide (Fluoride, Chloride, Bromide) and amine
- Bono test: pass
- RoHS & REACH compliant.
Application:
ECOFREC™ TF48 can be applied by dispensing or screen/stencil printing. The sticky properties ensure that components are kept in position until the alloy is reflowed. A variety of heating methods may be used to produce the solder joint; these include soldering irons, hot gas and hot bar devices, IR or convection oven or vapour phase. Printing adhesive properties can be improved after 30-60 minutes storage at ambient temperature or after heating at 50-60°C during few minutes.
Packaging:
- Syringe 10 g or 30 g
- Plastic jar 100 g or 500 g
- Cartridge 300 g