Partner prodotto: Inventec

TOPKLEAN™ EL 20D was specially designed by Inventec to remove flux residues in vacuum systems to provide an environmentally friendly solvent solution without compromising high cleaning performance.

Its performance in solubilizing organic compounds makes it possible to remove flux residues on PCBs after soldering.

TOPKLEAN™ EL 20D is compatible with most materials (metals, glasses, ceramics and plastics) used in electronic assembly; it is also ROHS compliant.

It can also be used as a co-solvent in vapor-phase systems, can be rinsed with PROMOSOLV™ DR1 or PROMOSOLV™ NEO A1.

TOPKLEAN EL 20D is NOT a Greenway product; although fully compliant with safety and environmental regulations, this product does not meet the strict criteria to be labeled as a Greenway product.

Features:

• Good solubility of flux residues
• Excellent compatibility with pcb, metals, glass, ceramics and many plastics
• Continuous recycling in equipment for long bath life
• Limited consumption due to airtight equipment
• Thermally and chemically stable during use, so no need for an additive
• Very low toxicity
• No destructive ozone potential (ODP) and no GWP
• High flash point
• Absence of aromatic and halogenated compounds.

Application:

The best process depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants.

Packaging:

• 20 l canister
• 200 l drum

TOPKLEAN™ EL 10F is a manual cleaning solvent useful for removing solder paste and uncured glues for SMDs. It can also effectively remove flux residues.

It is a halogen-free, low-odor and environmentally friendly solvent. It was developed by Inventec as a safer alternative to isopropyl alcohol or other cleaning chemicals with a very low flash point.

Excellent for manually cleaning screen printing foils, poorly screen printed boards and doctor blades.

TOPKLEAN™ EL 10F is a flammable product, so care must be taken. Compatible with standard components used in electronic assembly.

Has a low environmental impact and generates very low emissions at operating temperatures. Does not damage the ozone layer and is biodegradable.

TOPKLEAN™ EL-10F is used undiluted and can be easily rinsed with NOVEC™ HFE to speed up drying time.

Features:

• Fast and efficient cleaning performance
• Excellent compatibility with all metals and plastics
• pH-neutral product
• Fast cleaning
• Very low toxicity
• No ozone depletion potential (ODP)
• No halogenated compounds.

Application:
Best process depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants

Packaging:

• 20-l drum
• 200-l drum
• 500-mL spray

TOPKLEAN™ EL 20P is a next-generation oxygenated solvent specially formulated by Inventec to clean solder flux residues after reflow; its formula, improved over TOPKLEAN™ EL 20A, has greater sustainability and reduced surface tension to enable better cleaning in the presence of components with very low “stand-offs.”

Its excellent ability to solubilize organic and mineral compounds enables it to remove almost all solder flux residues used in the electronics industry today.

It leaves no white residue and imparts a shiny effect to alloys and metals.

TOPKLEAN™ EL 20P is used in the co-solvent process to provide a fast and sustainable cleaning standard with very high cleaning efficiency. In this process, the product is perfectly rinsed with fluorinated solvents such as PROMOSOLV™ DR1 and PROMOSOLV™ NEO A1.

The low surface tension of fluorinated solvents enables excellent results even in objects with complex geometry and under low “stand-off” components.

It dissolves any residual fluxes, resulting in very low levels of ionic contamination.

Features:

• Excellent solubility of organic and mineral residues
• Very low surface tension to allow excellent cleaning in the presence of low stand-off components
• Excellent compatibility with materials used on PCBs
• Allows for a glossy effect on sensitive alloys and soldered surfaces
• Waterless process – reduces the risk of corrosion
• Rapid process allows for increased production capacity
• Rinsing liquid is constantly recycled, limiting consumption
• No water consumption and no need for wastewater treatment
• Low toxicity and non-corrosive product
• No ozone destructive potential (ODP) and no GWP
• High flash point
• Absence of aromatic and halogenated compounds.

Application:

The best process to use depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants.

Packaging:

• 20-l drum
• 200-l drum