ECOREL™ FREE 305-21 is a solder paste specially designed for applications requiring high chemical reliability or where residue clean-up after remelting is required.
This product from Inventec has excellent values in the Bono corrosion test, a method that allows better quantification and differentiation of the risk related to corrosion mechanisms and leakage currents in No Clean processes.
On request, ECOREL™ FREE 305-21 is also available with other alloys and different grain sizes.
Features:
- Excellent wetting properties on all surface finishes, including OSP
- No graping, even on very small deposits
- Transparent and colourless residue, even after several remelting cycles
- Minimises downtime
- Good yield testability on first pass in ICT
- Lead-free
- Halogen free
- Free of CMR-containing substances.
Application:
The best process depends on factors such as operating conditions, equipment, board or component design.
SOLDER PASTE PREPARATION
Keep the paste at room temperature for at least 4 hours before use.
Before printing, it is essential to mix the solder paste correctly, either manually with a spatula or by making several preliminary prints on the stencil.
Automatic mixing of the solder paste is neither necessary nor recommended.
PRINTING GUIDELINES
Apply the solder paste to the stencil in such a way that it forms a 1 to 2 cm diameter roll along the entire spatula, or approximately 100 g per 10 cm length of the spatula.
In this way, the solder paste will roll easily under the squeegees to provide excellent print quality.
REFLOW GUIDELINE
Although this paste performs very well in air, a nitrogen atmosphere will further improve wettability, allowing for an even wider reflow process window.
A linear preheat ramp is recommended, however high density boards may require a soak zone during preheating to stabilise the temperature on the circuit before the reflow peak.
Packaging:
- 250 g or 500 g tin
- 600 g or 1200 g cartridges
- 30 g and 100 g syringes