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TOPKLEAN™ EL-20R

TOPKLEAN™ EL 20R

25 June 2021

TOPKLEAN™ EL 20R was developed by Inventec and is the booster version of TOPKLEAN™ EL 20A useful for cleaning solder paste residues and all types of solder flux and for cleaning poorly screen-printed boards.

Like TOPKLEAN™ EL 20A, this product can also be used as a co-solvent together with PROMOSOLV™ DR1 or the new PFAS-free solvent PROMOSOLV™ NEO A1.

TOPKLEAN™ EL 20R is a specially formulated cleaner to remove all types of flux residues and contaminants (fingerprints, dust, etc.) left on printed circuit board assemblies or semiconductor modules. Its chemical and physical characteristics enable it to effectively remove lead-free solder pastes and fluxes on the market and clean hard-to-reach areas.

Characteristics:

Not considered a flammable product, flash point is greater than 65°C
Avoid contact with eyes and skin
Has a low environmental impact, emissions are very low at operating temperatures. Does not damage the ozone layer and is easily biodegradable
Can be recycled by vacuum distillation without altering the composition and properties.

Application:

Inventec has designed a nonflammable process based on vapor-phase solvents for cleaning solder paste residues.

Packaging:

20 l can
200 l drum

PROMOSOLV™ RN2B

25 June 2021

PROMOSOLV™ RN2B is a solvent from Inventec specially developed for cleaning and rinsing electronic boards.

It is used in combination with the TOPKLEAN™ range to offer an environmentally friendly solution without compromising high cleaning performance.

PROMOSOLV™ RN2B is a formulation composed of 3M™ NOVEC™ 7100 hydrofluoroether, pentaflurobutane and isobutanol.

The low surface tension allows complete cleaning of objects with complex geometry.

This product is an equivalent to PROMOSOLV™ DR1 and 3M™ NOVEC™ 71 IPA.

Features:

No ODP
Non-flammable
Low toxicity
Low surface tension
Thermal and chemical stability.

As with most fluorinated liquids, PROMOSOLV™ RN2B is absorbed by fluorinated plastics and elastomers on prolonged exposure.

Compatibility tests of PROMOSOLV RN2 show good compatibility with a wide range of metals, plastics and elastomers, similar to the performance of perfluorinated liquids.

Application:

PROMOSOLV™ RN2B is, in addition, capable of removing dust, light oils and silicone oils.

It can also be used with the co-solvent process to:

Clean and rinse the product with a co-solvent for heavy greases, oils, fluxes
As a carrier for lubricants
Solvent for contact sprays
Heat transfer fluid
Fluorocarbons, hydrocarbons, silicones
Replaces CFCs and HCFCs.

Packaging:

35 kg drum
250 kg drum

PROMOSOLV™ 70 ES

PROMOSOLV™ 70ES

25 June 2021

PROMOSOLV™ 70ES was developed by Inventec as a drop-in replacement for trichloroethylene, NPB and other solvents.

It is useful for removing flux residues after reflow and other contaminants on PCBA, power modules, lead frames, BGAs, PoPs, and SIP applications.

The product’s low surface tension allows it to clean and rinse low stand-off components and hard-to-reach spaces very well.

It has excellent compatibility with all metals, including very sensitive ones, and also with most plastics and elastomers.

PROMOSOLV™ 70ES is formulated with safety in mind. Its composition offers excellent flammability suppression properties, which ensure high stability when used in equipment.

This product also exists in a recycled version (based on recycled solvent) under the name PROMOSOLV™ 70ES T.

Characteristics:

Thermally and chemically stable during use.
Low surface tension allows deep rinsing in the presence of low stand-off components
Short cleaning, rinsing and drying times
Continuous recycling in equipment for long bath life
Relatively high boiling point reduces the risk of solvent entrainment, limiting consumption
Very low toxicity
No GWP and no ODP
Non-flammable.

Application:

The best process depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants.

Packaging:

30kg drum
230kg drum

PROMOSOLV™ 70

25 June 2021

PROMOSOLV™ 70 was developed by Inventec to replace trichloroethylene, NPB and other solvents with high health, safety and environmental impacts.

While substantially reducing HSE impact, the degreasing power is of an equivalent level. Very low surface tension allows it to penetrate into very narrow or difficult-to-access spaces, providing deep cleaning and rinsing.

It is dedicated to the removal of most oils and greases, except water-based lubricants, and is suitable for removing waxes and cleaning pastes.

PROMOSOLV™ 70 is compatible with all metals and alloys and most plastics and elastomers.

The product is an azeotropic mixture that provides high stability when used in vapor phase systems.

PROMOSOLV™ 70 is qualified and used in the aerospace industry.

Features:

Alternative to chlorinated solvents, CFC and HCFC
Is an azeotrope-like product for the degreasing of heavy oils, greases, waxes, varnishes, particles and fluorinated lubricants
Can be used as a carrier solvent for the fluorocarbon lubricants, hydrocarbon and silicone
Is NOT concern by the FGAS regulation (no phase down)

Application:

The contact time may vary according to the surface part condition and the nature of the pollution; it is recommended to use it in a tank provided with a cover to limit evaporation.

Method: vapour phase process with ultrasounds
Concentration: Pure
Temperature: up to 43 °C

Packaging:

1 kg drum
30 kg drum
230 kg drum

PROMOCLEAN™ TP 186B

25 June 2021

PROMOCLEAN™ TP 186B is specially designed by Inventec for stripping polymerized or hardened substances that are difficult to remove, such as varnishes, resins, paints, glues, inks and lacquers. It is an improved formulation of TP 188, for which it has received Greenway certification, as its sustainability characteristics have been greatly improved.

PROMOCLEAN™ TP 186B contains no CMRs, aromatic solvents or chlorinated compounds such as N-methylpyrrolidone, benzene or methylene chloride.
Due to its good solubility in organic solvents and water, PROMOCLEAN™ TP 186B can be used in aqueous immersion and washing processes, but also in a separate process with co-solvent.

Having no pH, the cleaning medium does not harm sensitive metals or alloys and is safe to use. It is a product to be used pure.
PROMOCLEAN™ TP 186B can also be used in additive manufacturing as a substitute for hazardous and flammable solvents to dilute certain resins and polymers during maintenance or production.

Features:

Can remove many polymerized substances in large quantities
Effective from room temperature to 80° C
High solubility spectrum: only one product is needed to remove different kinds of substances
Long bath life: can be filtered and reused
Non-toxic and without CMR substances
Low environmental impact (GREENWAY product)
No chemical hazards
Low volatility reduces VOC emissions
High flash point.

Application:
The best process depends on factors such as operating conditions (particularly the time between complete cure and cleaning operation), equipment, desired cleaning time, and the nature of contaminants.

Packaging:

20-kg canister
210 kg drum

PROMOCLEAN™ DISPER 610

25 June 2021

PROMOCLEAN™ DISPER 610 is especially designed by Inventec for removal of all types of baked-on flux residues and recondensed gas emissions for maintenance purpose on electronic manufacturing equipment like wave frames, solder pallets, reflow oven condensation trap and screen printing frames.

Due to its formulation, it can remove all types of baked-on fluxes and resin residues without affecting plastic materials.

Having excellent antifoaming properties, it is suitable for spray-in-air processes; in addition, its controlled alkalinity makes this product compatible with aluminum and other sensitive materials.

It is a concentrated product that is used diluted with DI water and has excellent cleaning power from 20% to 30% dilution.

Features:

Excellent solubilization of organic compounds subjected to re-melting
Optional rinse step
Protects aluminum and sensitive materials during cleaning cycle Excellent long bath life
Concentrated product, reduces HSE transportation and storage costs
Non-toxic and CMR substance-free
Low environmental impact: GREENWAY product
Non-flammable.

Application:

The best process to use PROMOCLEAN™ DISPER 610 depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants.

In addition, a dedicated PCA kit is available to monitor the condition of the bath and a compatibility report with various materials.

Packaging:

20 kg canister
200 kg barrel

PROMOCLEAN™ DISPER 607

25 June 2021

PROMOCLEAN™ DISPER 607 is specially designed by Inventec for the removal of all types of flux residues.

Because of its excellent antifoaming properties, it is suitable for water-based processes by air spray and also by immersion.

Controlled alkalinity makes this product compatible with aluminum and other sensitive materials while providing high cleaning power.

It is a concentrated product that is used diluted with DI water and has excellent cleaning power diluted at rates between 20 percent and 30 percent.

PROMOCLEAN™ DISPER 607 is dedicated to cleaning PCBAs, power modules, lead frames, BGAs, PoP or SIP applications, and LED assemblies.

Its low surface tension allows for very good cleaning and rinsing of low stand-off components and spaces with complex geometry.

Features:

Excellent solubilization of organic compounds
High rinsing capacity
Protects aluminum and sensitive materials during cleaning cycle
High cleaning power even at low concentration
Excellent bath life
Concentrated product, reduces transportation and storage costs
Non-toxic and CMR-free
Low environmental impact: GREENWAY product
Non-flammable.

Application:

Best process depends on factors such as operating conditions, equipment, desired cleaning time, and nature of contaminants.

Packaging:

20-kg canister
200 kg drum

ECOREL™ FREE JP32

25 June 2021

ECOREL™ FREE JP32 is a solder paste designed by Inventec specifically to work on jet printing equipment and to ensure continuous and consistent deposits of solder paste.

Although the flux is chemically inert, it is easy to clean with water- or solvent-based processes.

ECOREL™ FREE JP32 can be used in Mycronic jet printing equipment.

ECOREL™ FREE JP32 does not require cleaning to meet IPC standards. The chemistry is specially designed so that any residual flux is chemically inert and has no impact on the assembled board or packaging under normal conditions.

However, when cleaning is desired or required (e.g., for high reliability assemblies or to improve conformal coating adhesion), flux residues can be easily removed with fluxes.

Features:

Excellent continuous and consistent paste deposits
Chemically inert flux residue that reduces the risk of electrochemical migration and corrosion
Easy cleanup of remelted flux residue with water or solvent processes
Stable process that reduces rework and scrap
Increases product life and reliability, reducing the risk of premature failure
Available with type 5 and 6 powder size
Halogen-free
Lead-free.

Application:

The best process will depend on factors such as operating conditions, equipment, board or component design.

Packaging:

Iwashita syringe 30 cc / 100g

ECOREL™ FREE 305-21

25 June 2021

ECOREL™ FREE 305-21 is a solder paste specially designed for applications requiring high chemical reliability or where residue clean-up after remelting is required.

This product from Inventec has excellent values in the Bono corrosion test, a method that allows better quantification and differentiation of the risk related to corrosion mechanisms and leakage currents in No Clean processes.

On request, ECOREL™ FREE 305-21 is also available with other alloys and different grain sizes.

Features:

Excellent wetting properties on all surface finishes, including OSP
No graping, even on very small deposits
Transparent and colourless residue, even after several remelting cycles
Minimises downtime
Good yield testability on first pass in ICT
Lead-free
Halogen free
Free of CMR-containing substances.

Application:

The best process depends on factors such as operating conditions, equipment, board or component design.

SOLDER PASTE PREPARATION

Keep the paste at room temperature for at least 4 hours before use.

Before printing, it is essential to mix the solder paste correctly, either manually with a spatula or by making several preliminary prints on the stencil.

Automatic mixing of the solder paste is neither necessary nor recommended.

PRINTING GUIDELINES

Apply the solder paste to the stencil in such a way that it forms a 1 to 2 cm diameter roll along the entire spatula, or approximately 100 g per 10 cm length of the spatula.

In this way, the solder paste will roll easily under the squeegees to provide excellent print quality.

REFLOW GUIDELINE

Although this paste performs very well in air, a nitrogen atmosphere will further improve wettability, allowing for an even wider reflow process window.

A linear preheat ramp is recommended, however high density boards may require a soak zone during preheating to stabilise the temperature on the circuit before the reflow peak.

Packaging:

250 g or 500 g tin
600 g or 1200 g cartridges
30 g and 100 g syringes

ECOFREC™ CMA 155

25 June 2021

ECOFREC™ CMA 155 is a flux produced by Inventec with high rosin that exhibits excellent wetting and is easy to clean with solvents or detergents.

It contains halogens, which help solve soldering problems encountered in professional and high-end consumer applications.

This flux was specially developed to respond to all soldering problems encountered in high-quality professional and consumer applications.

ECOFREC™ CMA 155 flux offers an excellent compromise between good activation for efficient deoxidation of all PCBs and very little subsequent aggressive action.

ECOFREC™ CMA 155 ensures uniform, bright, low-charge solder. Tinnings on power lines show no wetting; they are uniform, with no spills or side drops.

Due to capillary action, it ensures complete, hole-free or gutter-free filling of PTHs, provided PCBs have been steam-heated prior to soldering.

Ensures a uniform, bright and lightly charged solder. The tin plating on the feed lines show no wetting. They are uniform, with no spills or side drops.

Features:

High rosin content (14%)
Compatible with various lead-free PCB finishes such as Ni/Au, Sn, Ag, HAL and OSP
Excellent wetting
Easy to clean
Solves problems for difficult-to-solder applications
No CMR substances.

Application:
ECOFREC™ CMA 155 flux can be used in all kinds of usual fluxing processes: foam, wave, spray, etc.
After fluxing, it is advisable to preheat the PCB to 80/100°C to ensure proper activation of the flux.
The typical recommended soldering temperature is 245/250°C, but it can be adapted to the type of PCB and the speed of the wave process.

Packaging:

20 kg canister